奇景光電 (HIMX) 2017 Q3 法說會逐字稿

Good day, ladies and gentlemen, and welcome to the Himax Technologies Third Quarter 2017 Earnings Conference Call. (Operator Instructions) As a reminder, this conference call may be recorded.

I would now like to turn the conference over to Greg Falesnik, external Investor Relations from MZ.

Thank you, operator. Welcome everyone to Himax's Third Quarter 2017 Earnings Call. Joining us from the company are Mr. Jordan Wu, President and Chief Executive Officer; and Ms. Jackie Chang, Chief Financial Officer. After the company's prepared comments, we've allocated time for questions in a Q&A session. If you have not yet received a copy of today's results release, please e-mail greg.falesnik@mzgroup.us or access the press release on financial portals or download a copy from Himax's website at www.himax.com.tw.

Before we begin the formal remarks, I'd like to remind everyone that some of the statements in this conference call, including statements regarding expected future financial results and industry growth, are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this conference call. Factors that could cause actual events or results to differ materially from those described in this conference call include, but are not limited to, general business and economic conditions, the state of the semiconductor industry, market acceptance and competitiveness of the driver and non-driver products developed by Himax, demand for end-use application products, the uncertainty of continued success in technological innovations, as well as other operational and market challenges and other risks described from time to time in the company's SEC filings, including those risks identified in the section entitled Risk Factors in its Form 20-F for the year ended December 31, 2016, filed with the SEC in April 2017.

Except for the company's full year of 2016 financials, which were provided in the company's 20-F and filed with the SEC on April 12, 2017, the financial information included in this conference call is unaudited and consolidated and prepared in accordance with U.S. GAAP accounting. Such financial information is generated internally and has not been subjected to the same review and scrutiny, including internal auditing procedures and external audits by an independent auditor, to which we subject our annual consolidated financial statements and may vary materially from the audited consolidated financial information for the same period. The company undertakes no obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events or otherwise.

I will now turn the call over to Ms. Jackie Chang. The floor is yours.

Thank you, Greg and thank you everybody for joining us. Our outline for today's call is, first, I will review Himax's consolidated financial performance for the quarter on both GAAP and non-GAAP basis. The non-GAAP financials exclude share-based compensation and acquisition-related charges. I would then review operating expenses. Finally, I will conclude with the fourth quarter outlook. Jordan will then provide a brief update on the status of our business, after which we will take questions.

Our 2017 third quarter revenues and GAAP earnings per diluted ADS came in at high end of our guidance, while gross margin and non-GAAP earnings per diluted ADS both exceeded guidance. For the third quarter, we reported net revenues of $197.1 million, an increase of 29.9% sequentially and a decrease of 9.6% year-over-year. Gross margin was 25.5%, up 1.7% sequentially, outperforming the guidance by 0.7%.

GAAP earnings per diluted ADS were 2.1 cents compared to the guidance range of 1.3 to 2.5 cents. Non-GAAP earnings per diluted ADS were 5.2 cents compared to the guidance range of 3.0 to 4.2 cents.

Revenue from large panel display drivers was $54.9 million, up 5.4% sequentially and down $23.7% year-over-year. Large panel driver ICs accounted for 27.9% of our total revenues for the third quarter, compared to 34.4% in the second quarter of 2017 and 33.0% a year ago. As opposed to the original guidance of 10% sequential growth, our large panel driver business grew just mid-single digit as one of our Chinese customers deferred some shipment to Q4. The sector's rebound from the first half was driven primarily by stronger sales in TV market. The year-over-year decline was caused by phase-out of certain customers' old models. We are pleased with our current engineering collaboration and design-in activities with large panel customers across China, Taiwan and Korea. Such activities will lead to further rebound in future sales momentum.

Revenue for small and medium-sized drivers came in at $87.2 million, up 24.5% sequentially, but down 12.2% year-over-year. The product segment accounted for 44.2% of total sales for the third quarter, as compared to 46.1% in the second quarter of 2017 and 45.5% a year ago. Sales into smartphones rebounded strongly, up more than 30% sequentially, but still declined 36% year-over-year. The strong smartphone driver IC sales were driven by customers' replenishment of inventories after a lackluster first half. Shipment of 18:9 display driver ICs to panel makers for Tier-1 end customers also contributed to the strong rebound. The year-over year decline in the third quarter was mainly the result of a shrinking addressable market for pure TFT-LCD driver ICs for smartphones, a significant portion of which is being replaced by TDDI and AMOLED technologies, as we highlighted in previous earnings calls. The good news is that our TDDI solutions have started some shipment in the third quarter and are expected to start ramping in Q4. Jordan will elaborate on this a bit later.

Our small and medium-sized driver IC revenue for automotive application went up single digit sequentially and more than 20% year-over-year. The quarterly revenue now reached more than $20 million, a historical high, accounting for over 15% of the total driver IC revenue. Driver IC sales for tablets were also up strongly, increasing over 25% sequentially, but declining 6.8% year-over-year, due to weak overall market demand in the product segment.

Revenues from our non-driver businesses were $55.0 million, up 85.9% sequentially and up 17.5% versus last year. Non-driver products accounted for 27.9% of total revenues, also a record high, as compared to 19.5% in the second quarter of 2017 and 21.5% a year ago. The sequential and year-over-year increase was due primarily to WLO product shipment to a leading customer, as well as certain one-off customer reimbursements related to our AR goggles business. The revenue increase was offset by the discontinuation of LCOS and WLO shipments to one of our major AR device customers who decided to end the product's production as we reported before. Excluding the above-mentioned one-off customer reimbursements, which totaled $13.3 million, the sequential increase would have been lower but still at a high level of 40.9%.

Our GAAP gross margin for the third quarter was 25.5%, up 170 basis points from 23.8% in the second quarter of 2017 and down 10 basis points from 25.6% for the same period last year. The sequential margin improvement was a result of a more favorable product mix, which was due mainly to our WLO shipments starting July 2017 and the one-off customer reimbursements, as I mentioned earlier.

Now let's take a look at operating expenses. GAAP operating expenses were $47 million in the third quarter, up 26.6% from the preceding quarter and up 16.2% from a year ago. The significant sequential expense increase, on top of rising R&D expenses, was caused by $6.1 million of RSU expense. The RSU expense was assumed to be $3.0 million in our guidance. The $3.1 million higher RSU represents lower EPS of 1.5 cents.

As an annual practice, we reward employees with an annual bonus at the end of September, which always leads to a substantial increase in the third quarter GAAP operating expenses compared to the other quarters of the year. This year, the RSU grant totaled $6.5 million, out of which $6.1 million was vested immediately and expensed in the third quarter. The remainder will be vested equally at the first, second and third anniversaries of the grant date. Excluding the RSU charge, our third quarter operating expenses were $40.9 million, up 10.2% from the previous quarter and up 31.1% from the same quarter 2016. The significant year-over-year increase was primarily the result of rising R&D expenses in the areas of 3D sensing, WLO, TDDI, and high-end TV as well as the annual merit increase. In addition, NT dollar appreciation against the US caused our salary expense to increase around $0.9 million, as we pay the bulk of our employee salaries in NT dollars.

GAAP operating margin for the third quarter was 1.7%, down from 7.0% for the same period last year and up from -0.6% in the previous quarter. The sequential improvement was due to gross profit increase, which was mainly driven by WLO shipments and the one-off customer reimbursement mentioned earlier. The year-over-year decline was, however, a result of higher operating expenses and lower sales.

Third quarter non-GAAP operating income was $10.2 million, or 5.2% of sales, down from 11.5% for the same period last year and up from -0.3% a quarter ago.

GAAP net income for the third quarter was $3.7 million, or 2.1 cents per diluted ADS, compared to GAAP net loss of $0.6 million, or 0.4 cents per diluted ADS, in the previous quarter and GAAP net income of $13.6 million, or 7.9 cents per diluted ADS a year ago. Third quarter non-GAAP net income was $9 million, or 5.2 cents per diluted ADS, compared to non-GAAP net loss of $0.3 million, or 0.2 cent per diluted ADS, in the previous quarter and non-GAAP net income of $21.3 million, or 12.4 cents per diluted ADS, a year ago.

Turning to our balance sheet. We had $151.6 million of cash, cash equivalents and marketable securities as of the end of September 2017, compared to $153.4 million at the same time last year and $185.9 million a quarter ago. We paid out a dividend of $41.3 million during the quarter. In addition to the cash position, restricted cash was $147.2 million at the end of the quarter, up from $107.2 million in the preceding quarter and up from $138 million a year ago. The restricted cash is mainly used to guarantee the company's short-term loan for the same amount. We continue to maintain a very strong balance sheet and operate as a debt-free company.

As of September 30, 2017, our inventories were $130.1 million, down from $147.7 million a quarter ago and decreased from $169.4 million at the same time last year. The lower inventory was a result of increased shipments in the quarter. Accounts receivable at the end of September 2017 were $181.7 million as compared to $208.4 million a year ago and $163.2 million last quarter. DSO was 98 days, as compared to 95 days a year ago and 96 days at end of the last quarter.

Net cash inflow from operating activities for the third quarter was $16.9 million as compared to an inflow of $2.9 million for the same period last year and an outflow of $1.2 million last quarter. The sequential increase was mainly due to higher profit, and better working capital situation.

Capital expenditures were on track with the plan at $10.2 million in the third quarter of 2017, versus $1.9 million a year ago and $11.9 million last quarter. The third quarter capex consisted mainly of capacity expansion for WLO production line and ongoing payments for the new building's construction. As reported in the last few earning calls, we are increasing capex right now to enlarge our WLO capacity located at the current headquarters to meet certain anchor customers' strong and urgent demand. We are also constructing a new building to house further WLO capacity, active alignment equipment, next generation LCOS production line, and additional office spaces. As part of our 3D sensing total solution, extremely high precision active alignment equipment is required to assemble optics on top of laser. We mentioned in earlier earnings calls that we have partnered with a world leading equipment vendor to develop a dedicated active alignment solution of our own.

As we reported in the previous earnings calls, the capex budget will be funded through our internal resources and banking facilities if needed.

As of September 30, 2017, Himax had 172.1 million ADS outstanding, a little changed from last quarter. On a fully diluted basis, the total ADS outstanding are 172.4 million.

For the fourth quarter of 2017, we expect the revenue to be down around 4% to 10% sequentially. We reported a one-off customer reimbursement of $13.3 million in the third quarter which will not repeat in the fourth quarter, thus causing a sequential decline. Excluding the one-off reimbursement, Himax expects the fourth quarter revenue to be down around 3.5% to up 3.0% sequentially. Gross margin is expected to decline around 1%, depending on our final product mix. GAAP earnings attributable to shareholders are expected to be in the range of 13.0 to 15.0 cents per diluted ADS based on 172.5 million outstanding ADSs. Non-GAAP earnings attributable to shareholders are expected to be in the range of 13.2 to 15.2 cents per diluted ADS based on same number of ADSs.

The above earnings guidance includes the disposal of an investment, netting 12.0 cents in earnings per diluted ADS. As many of you have already seen in our PR issued on September 26th, we reached an agreement with a buyer to dispose of a direct investment which was made over 2007 to 2008. The investment involves a China-based operation, providing display driver IC backend processing covering wafer bumping, chip testing and packaging. Himax's initial investment amount of $8.96 million represented a minority stake of 14.46% in the investee company. Total proceeds from disposal are $32.0 million with a pre-tax gain of $23.04 million. Gain after tax is estimated to be $20.74 million, representing a contribution of 12.0 cents GAAP net income per diluted ADS. The transaction is subject to relevant government approvals with closing expected to be no later than the end of the fourth quarter, 2017.

I'll now turn the call over to Jordan.

Thank you, Jackie. Despite the decline in the first half in our business, we delivered solid results in the third quarter, achieving both top and bottom line growth across all three major product categories. One of the highlights of our third quarter business is the joint announcement with Qualcomm to unveil our 3D sensing total solution. The announcement detailed the two companies' collaboration in the development and commercialization of high resolution, low power active 3D depth sensing solution for the Android smartphone ecosystem. 3D sensing is a game-changing opportunity for Himax. It will be our biggest growth engine for the next few years. With that, now let me give you some details behind our guidance and trends that we see developing in our businesses.

Our large display driver IC business rebounded in the third quarter from the trough of the first half. We expect the momentum to carry forward into the fourth quarter and next year as China continues to ramp new advanced generation LCD fabs and 4K TV penetration is still on the rise globally. Being a market leader in both areas, we will benefit from the resulting market expansion. At the moment, due to tight foundry capacity, we are not able to fulfill some rush orders. This would affect our growth in the fourth quarter. We expect a moderate sequential revenue increase for large display driver ICs in the fourth quarter. Looking into the future, we are working with major panel makers on the development of next generation 8K TVs. 8K TV will likely take off as early as 2020 with Tokyo Olympics, which has promised to broadcast 8K programs.

In our last earnings calls, I discussed how full-screen 18:9 displays are becoming a trend and how we expect higher TDDI penetration in smartphones going forward. Both of these trends held true and continued to accelerate in the third quarter. Our 18:9 display driver ICs are expected to contribute to 25% of our smartphone display driver IC revenue in the fourth quarter, of which FHD+ 18:9 shipments will double.

In terms of our progress in TDDI, I'm pleased to announce that we have started some small volume shipment of our new generation TDDI ICs in the third quarter. We now boast a comprehensive product portfolio supporting both full screen 18:9 and traditional 16:9 aspect ratios. We expect our design wins of HD+ TDDI for smartphone to make meaningful contribution to revenue in the fourth quarter. Our FHD+ TDDI solutions adopt industry leading interlaced output design which requires less space for the customer's panel routing and therefore enables super-slim bezel for the customer's panel design. We have on-going design-in activities with many of the Chinese tier-1 smartphone brands and most of the panel makers in China, Japan and Korea. We expect some of them to start mass production in the first quarter of 2018. In summary, we are looking to ship a few million units of TDDI ICs during the fourth quarter and seeing strong growth starting 2018. TDDI has higher ASP and better margin than traditional driver IC with less competition. Hence, we expect the shipment of TDDI ICs will lead to margin improvement of our small and medium panel driver ICs starting 2018.

Now I will talk about AMOLED business. AMOLED is set to become mainstream in the global smartphone market in the future with penetration potentially reaching as high as 50% by 2020. We have joint development projects with many major Chinese OLED panel makers and have delivered 18:9 product samples to some of them starting the second quarter. With Chinese smartphone brands' AMOLED adoption forecast to reach 18% in 2017, Chinese panel makers have committed tremendous capital to build nine brand new OLED fabs by 2019, and are in full speed to pull forward the mass production schedule. Once Chinese panel makers start mass production, we believe OLED driver IC will be one of the long-term growth engines for our small panel driver IC business.

We expect driver IC sales for automotive application to grow around 20% sequentially and close to 35% year-over-year, far surpassing market average, as some of the major design-wins from prior years started going into mass production. Still more panels are going into vehicles, with the number of units expected to increase from 135 million in 2016 to 200 million in 2022. We have engaged all of the major automotive panel manufacturers worldwide for long-term partnerships and secured many of their key projects pipelined for the next few years.

Going into the fourth quarter, due to seasonality and smartphone OEM customers' inventory adjustment to accelerate the product transition from 16:9 to the new full screen 18:9 design, we expect small and medium-sized drive IC revenue to be flat sequentially.

The non-driver IC business segment has been our most exciting growth area and a differentiator for Himax in the last few years. Now let me share some of the progress we made in the last quarter, as well as future growth opportunities.

First, I will touch on our 3D sensing total solution. We have always said 3D sensing is among the most significant new features for the next generation smartphone. We are excited that Apple has pioneered the 3D sensing technology on iPhone X and is paving the way to smartphone -- is paving the way for smartphone to become a major AR platform. In the Android market, we are seeing leading players also aggressively looking to adopt 3D sensing. Judging by their current development activities, we expect some of China's leading smartphone names to launch flagship models with 3D sensing during the first half of 2018.

While 3D sensing can have a wide range of applications across smartphone, IoT, automotive, AR/VR, robotics, etc., our current target market is primarily the smartphone. SLiM (Structured Light Imaging Module), our turn-key total solution, has already achieved the performance, size, power consumption, and costs suitable for smartphones. I cannot over-emphasize the importance of a total solution approach in 3D sensing as it reduces the customer's integration complexity to a minimum and is essential for most of the Android OEMs. The Qualcomm/Himax solution, with Himax being the product owner of the total SLiM module, is state-of-the-art in its technological sophistication and the only true 3D sensing total solution available for the Android markets right now. 3D algorithm, projector and receiver are the 3 fundamental building blocks of 3D sensing. Our SLiM total solution brings together Qualcomm's industry-leading 3D algorithm with Himax's advance diffraction optical element (DOE) design and mass-production-proven wafer level optics for the projector and cutting-edge NIR sensors with superior quantum efficiency for the receiver. To complete our turn-key solution for the Android market, we have put together an A team by partnering with a few top players in their respective industries, covering laser, NIR camera lens, IR filter, semiconductor foundry and module assembly. This strong alliance will ensure that our SLiM 3D sensing total solution will be an accountable and competitive total solution for customers' volume ramping.

The majority of the key technologies inside the SLiM total solution is developed and supplied by Himax ourselves. These critical technologies include, on the projector end, DOE and collimator utilizing our world leading WLO technology, a tailor-made laser driver IC, and high precision active alignment for the projector assembly; and on the receiving end, a high efficiency near-infrared CMOS image sensor. Last but not least, Himax also developed an ASIC by incorporating Qualcomm's algorithm for 3D depth map generation. The fact that all of these critical components are developed in-house puts us in a unique leading position. It represents a very high barrier of entry for any potential competition and a much higher ASP and profit margin for us. While we prefer to offer a total solution, we can also provide the aforementioned individual technologies separately to a small number of select customers who possess in-house 3D sensing integration capabilities so as to best accommodate their specific needs.

We are seeing very strong demand for the SLiM total solution amid the Android smartphone market. We are tightly focusing on just a few top tier smartphone makers, with whom we are in close collaboration right now. We, together with our target customers, are aiming to launch 3D sensing smartphones during the first half of 2018.

Our own SLiM solution and production capability will be ready for mass production and shipment by the end of the first quarter of 2018 with an initial capacity of 2 million units per month. The initial capacity is part of our Phase I investment of $80 million. We will ramp as needed to meet our customers launch timetable and will soon announce Phase II expansion as I will discuss in a moment. Given that we are offering highly integrated solutions with ASPs much higher than those of individual components, by the time we start shipping our total solutions, they will be a major contributor to both our revenues and profit, consequently creating a more favorable product mix for us.

In the last earnings calls, we reported that this year's capex will be significantly higher than usual. We also reported the urgent addition of new WLO capacity to meet the rush demand of a leading customer. This new capacity is located in our existing headquarters in which we retrofitted space to make room for the new equipment. We are pleased to report that the project is going smoothly as planned. We have started mass production and shipment to the above mentioned customer during the third quarter. We expect shipment to accelerate to the same customer into the fourth quarter and beyond. In parallel, we are working with several new development projects with the same customer for their future generation products. We are very excited about the partnership and the significant growth opportunities these projects represent.

Now let me move on to other WLO business updates. WLO is one of the key technologies enabling 3D sensing, AR goggle devices, and many other applications. At present, 3D sensing is the top priority of our WLO business. Levering on our exceptional design know-how and mass production experience in WLO technology, we are able to produce the world's most compact optics required of 3D sensing while achieving superior performance. In addition to 3D sensing, we also have ongoing collaborations with customers in developing wave-guide for AR glasses and micro displays using our WLO technology.

Now let's move on to the other major capex project of this year, construction of a new building. The progress has been good to date and everything is proceeding according to schedule. The new building, located near our current headquarters, will house additional 8" glass WLO capacity and new active alignment equipment that I just mentioned. It will also provide the extra office space we desperately need. The new building will be completed and ready for our personnel and equipment move-in at around the new-year period of 2018.

As reported before, among all of the components in our 3D sensing total solution, the only two items requiring our own major capital expenditure are the WLO production line and the active alignment equipment. The two items are not outsourced because they require highly differentiating manufacturing know-how and are critical factors of our competitiveness.

Judging from the strong 3D sensing demands from the existing leading WLO customer and the new Android OEMs, we are getting customers' input to finalize Phase II capex for additional capacity in 2018. While the plan is yet to be finalized, the scale of the investment would likely substantially exceed the Phase I capex of $80 million. Unlike the Phase I investment where majority of the capex is going to land and building, the Phase II investment will be exclusively for the enlargement of our WLO and active alignment capacity. The Phase II capacity will still be located in the same new building. In fact, the new building has sufficient room to house capacity much in excess of the Phase II expansion. We will formally announce the Phase II expansion once we finalize the plan.

As Jackie mentioned earlier, the capex budget for Phase I and Phase II expansion will be funded through our internal resources and banking facilities, if so needed.

Now on to our CMOS image sensor business update. We continue to make great progress with our two machine vision sensor product lines, namely near infrared (NIR) sensor and Always-on-Sensor (AoS). Our NIR sensor is a critical part of the SLiM total solution which I discussed earlier. Our NIR sensors' overall performance is far ahead of those of our peers in 3D sensing application. We currently offer low noise HD, or 1 megapixel, and 5.5 megapixel NIR sensors and are planning to add more to further enrich our product portfolio. Our NIR sensors deliver superior quantum efficiency in the NIR range, especially over 940nm band which is critical for outdoor applications.

On the AoS product line, armed with Emza's machine-vision algorithm, we are working with major consumer electronics and home appliances OEMs to add people sensing capabilities into their products where our WiseEye system detects human presence reliably with extremely low power consumption to enhance user experience. Following one major global brand's adoption in the high end TV models in the first quarter of 2017, we expect several new projects will enter mass production in 2018, especially in the TV market.

For the traditional human vision segments, we see strong demands in notebooks and increasing shipments for multimedia applications such as car recorders, surveillance, drones, home appliances, and consumer electronics, among others.

I will now update the LCOS business where our main focus areas are AR goggle devices and head-up-displays (HUD) for automotives. Our list of AR goggle device customers covers many of the world's biggest tech names. We continue to see heavyweight companies allocating major R&D resources and budgets to bring new products into the market. We are committed to provide the best technology to support them in the effort. In addition to AR applications, we are pleased to report that we are making great progress in developing high-end HUD for automotives. Our technology leadership in this space has little competition. LCOS represents a significant long term growth opportunity for us.

For our non-driver IC business in the fourth quarter, Jackie just reported third quarter one-off customer reimbursements of $13.3 million, which will not repeat in the fourth quarter, thus causing a sequential decline of 20% for our non-driver revenue, yet an increase of close to 20% from the same period last year. Excluding the reimbursements, the non-driver revenue would be up 10% sequentially, where WLO would grow around 20%.

That concludes my report for this quarter. Thank you for your interest in Himax. We appreciate you joining today's call and we are now ready to take questions.

(Operator Instructions) Our first question comes from the line of Thomas Sepenzis of Northland.

I'm just curious, given that the large panel business is slowing down because of, I'm assuming, component issues in Q4, going into the new year, do you think that March could see actual flat-to-up revenue, given the addition of the 3D business?

I think if you talk about March, then the answer is quite likely to be yes. However, if you talk about first quarter, you know the first quarter is a low season with the Chinese New Year, long holiday. So we are not providing first quarter guidance yet, but don't be too optimistic in the overall first quarter result. But March, I think, yes, the market is very likely to recover.

Great, thank you. But you wouldn't expect to see any of the 3D sensing revenue until Q2, right?

That's correct, although in Q1, there will be some revenue contributing by selling samples to our customer for our joint verification and qualification of the products. So there'll be some, but not significant, but Q2 will be -- likely to be significant.

And then lastly, just the 2 million a month target seems pretty small relative to the opportunity for the year. So how quickly can you ramp and do you have a target for where you want to be by the end of '18?

Yes, 2 million is small, but we -- actually the 2 million is located within our existing headquarters, which is extremely crowded. So our current bottleneck is really the space and that is why we are building the -- we are constructing a new building. Now as I mentioned, the new building will be ready for personnel and equipment move-in around the close of the year. We have placed orders for the equipment, so we committed to our customers initial capacity will be 2 million and within 2018, our total capacity will reach in-between 5 million to 6 million. And we can actually add more if the demands are strong and as it looks like to be, but that is our current plan for the time being.

Our next question comes from the line of Tristan Gerra of Baird.

First question on the TDDI business. Now TDDI ramp is happening and you've mentioned design wins in different geographies. What type of revenue and market share do you expect from TDDI next year? And also as a second embedded question, if you could remind us of the TDDI adoption rate in smartphone, exiting this year and what you expect it to be exiting next year?

I think TDDI -- I mean to make a projection for the whole year -- for the whole of next year, I think it will be too early. But I think it is fair to say we are very committed. In Q1, we actually said in our prepared remarks that we have been shipping several million units within Q4 and I think a conservative estimate for Q1 will be around 10 million or a bit more and I think we can expect to almost double that quarter-after-quarter. So I think next year will be very interesting, although, as I said, it is fair to say that to make the whole year projection is probably too early. And revenue wise, it depends on your resolution release HD+ or Full HD+ and also it depends on -- if you are thinking about Full HD+, it depends on whether the customer needs the memory in the IC, right, SRAM. And on top of that, there's also a newly developing trend where for very high-end models, customers may actually require, what we call a design including COF, C-O-F. By saying that, what a customer is trying to achieve, with TDDI, you can make your bezel narrow and with COF, you can even make the bezel even more narrow, because with COF, you can sort of hide the IC on the back side of the panel. So IC effectively doesn't occupy any space for the bezel. So with all that combined, certainly with cost and with memory at Full HD+, that will be the highest ASP. But I think on average, the ASP for TDDI will be more or less double compared with pure driver IC. So this sort of gives you an idea if you want to run your model, this some sort of -- give you some idea, but I'm afraid, I cannot provide a full year guidance for now.

That's very useful, thank you. And then what are the opportunities for your infrared sensor outside of 3D sensing, potentially in partnership with other companies, whether it's for fingerprint recognition or other application?

Right. Firstly, for fingerprint, I mean the newest development as we have all seen in the newest iPhone, they actually eliminated fingerprint all together, replaced it by 3D sensing. And we are actually -- we are betting very, very big on 3D sensing as you guys all know. So that kind of explains we are not super-active or super-aggressive on fingerprint. However, there is a new trend, new technological trend of fingerprint, which is specific for OLED displays. So people are expecting full screen for your cell phone, that means there is no room for the fingerprint button. So either you remove fingerprint altogether, like iPhone X or you hide your fingerprint underneath the display. But for OLED display to do that it's very, very difficult. It's not possible, because OLED generates a lot more noises and that kind of hinders your fingerprint sensor signal to reach the quality required. And therefore, we are working with a leading customer on a new approach, which is called our optical fingerprint approach. By saying that, all we provide is our state-of-the-art CMOS image sensor. And CMOS image sensors, they require ultra sensitive signal to noise ratio, right, ultra high signal to noise ratio, because you are talking about very, very, very low light environment. So we are in the forefront. We believe we are in the very late stage of customer qualification. As for the ramp time or the potential volume, I cannot comment on customer's behalf. And if this happens, this will be the first of its kind. So I think it is fair for me to say that being a critical component provider, I think it will be too premature for me to also even comment on the potential customer launch timetable for [OLED]. But what I can say is that this is happening, and we are certainly excited about the involvement in this very technically challenging and yet state-of-the-art technology development.

Great. And then last quick question, you mentioned heads-up display is clearly -- that's a trend in the automotive. What type of timing are we looking at in terms of potential ramp, what type of design win or engagements do you have, and does that expand beyond the automotive market?

I think, we and our partners together, I think, we have secured a few design wins with certain big names. In terms of timing, in terms of revenue contribution, time for major revenue contribution, timing for us, I think, I'm looking at 2020 or if everything -- if we get very, very lucky then 2019 perhaps. And over there, we are talking about very high-end segment for head-up displays. With (inaudible) poly, LCD displays, one can also head-up display, but that is lower end. We are talking about very high-end target market with even several layers of virtual image depth. So that for example you can feel in a transparent large-screen full color display in the nearest distance, for example you get to see your speed, your gasoline level and so on, and in the further distance, you get to see, for example, your GPS or other information. And it is very exciting, I've seen a few demos, I have never seeing anything like that. And so it is again state-of-the-art and our customers are very excited, I can tell you that. But automotive, you know, takes a long time to materialize. However, once they materialize, I think it will be here to stay for a very long time. So that is an often overlooked business potential or market for our investors, but I think I'm actually very excited about that.

(Operator Instructions) Our next question comes from the line of Jaeson Schmidt of Lake Street Capital.

Just looking at the 3D sensing opportunity, is there a way for you to help us size the total opportunity at Android, how many customers that potentially could be next year? I know you mentioned 2 million units per month, but just trying to get a sense of the total opportunity with the Android OEMs next year.

Okay. Again, 2 million is the initial capacity and we are limited by our space. I do want to mention it again. So I think, within next year, by the year-end more likely capacity will be somewhere in the range of 5 million to 6 million. And the year after will be much bigger. Now in terms of our potential revenue size, I would just give you an idea. I, even in my prepared remarks in this time I tried to make myself more clear about our business model, because I've seen a lot of first report or analyst report and many of them are rather misleading. what's very important to understand is that we are -- we Himax are the total module owner. And we are also the integrator, and we also happen to design and manufacture a lot of the key components within the module ourselves. So that in itself potentially makes our margin better, because we don't have to source everything from outside. And being the module integrator and the total module product owner will enable us to enjoy the most revenue. To give you an idea, give and take, we are thinking about $20 per unit, So assuming a initial capacity of just 2 million, 2 million, as you guys all know is tiny in the cellphone market. But even make that conservative assumption, you are talking about $40 million of potential sales per month, i.e. $20 and 2 million, that's $40 million per month, and i.e. $120 million of sales per quarter. That compares to our current quarterly revenue of $200 million, it's already hugely significant and certainly it will significantly boost our gross margin as well. So the potential revenue and margin implication for Himax is tremendous.

Okay, thank you for that. That's helpful. And then looking at next year, how should we think about OpEx ramping?

Part of the $80 million were actually, in terms of CapEx booking will be next year. The $80 million is primarily about 3 things. The first thing is our land and building, which is over -- which is about $50 million, so it is the bulk of our first phase of investment. And the second thing is for that anchor customer that I -- we mentioned, the WLO capacity addition in the the headquarter building, that has already started depreciation already, meaning the CapEx is already booked. And the third part is for our own SLiM module total solution CapEx, which includes certain WLO capacity and certain active alignment capacity, I just mentioned. So the 3 together. The second phase, again we haven't finalized the plan, but we are doing an analysis ourselves and we are getting a lot of input from our customers. It looks like the total amount it's going to be bigger than $80 million. Now by how much I cannot tell for certain yet, but it will be bigger. But what's very, very important for you to understand is that as I mentioned earlier, in the $80 million in the phase I, actually $50 million goes to land and building, meaning the so-called non-revenue generating CapEx, right, assets. But the second phase will be all about the equipment, about capacity, certainly with a little bit of spending on clean room as well. But the land is already there, the building is already there. And even assuming we are going to put up another $100 million or $120 million for phase II let's say. And all of that goes to capacity addition. Even with that, our building is still empty -- still more than half empty, meaning the existing building, the second building, the building under construction right now can house a lot more capacity. And the building is actually occupies only 30-some to 40% of the land, meaning with the land we can even have a bigger and third building. What I'm trying to say is the $80 million in phase I, actually $50 million of which is actually for phase II or phase III's purposes, and i.e., and in any future capital expenditure, Phase II or Phase III or whatever, the money will go straight to more revenue generating assets and -- but even that we believe we are very optimistic about Phase I $80 million return.

Our next question comes from the line of Sujee Desilva of Roth Capital.

Jordan talked about ASP of $20. Can you talk about if there is a range for that across customers, so we can understand kind of what the low and high end could be around $20?

Well, we are really offering just 1 solution, total solution right now and we are actually giving our customers rather little flexibility to manipulate. Why? Not because we feel we are the sole source provider and we have the position to be snobbish. It is really because the total solution involves a lot of pairing and matching and optimization and trade-off and compromises among different components of the module. And that is why integration is so critical. Right. let's say for the sake of argument. You are the customer, you ask me can I -- Himax you provide your own driver IC. Actually I know of a friend of mine who can also provide a laser driver IC, and they are quoting lower price. I am sorry, I cannot accept that, because it is very likely that it will mess up our entire system and even certain critical functions of our entire system may not be achieved. So right now we are talking to a very small number of select customers, because we are honestly limited by bandwidth and also the fact is that in China, if you count the first [top tier] smartphone makers, they already account for a very big chunk of the market share already. So I think for us being the leader in the market to park it on the leader of the smartphone names, I think it makes sense. And as a result, they are all big customers and we are offering one solution. So I can't image there is a big price differentiation among them, I can't image that.

Great that's very helpful color Jordan. And then I know you can't tell us the magnitude of the Phase II CapEx, but can you tell us the timing of when you'll know that, how soon that will be?

Effectively, we are already placing certain equipment orders already. We just haven't finalized the plan that it's mature enough to announce to the market, because that requires a lot of customers input, we don't want to be saying the wrong thing. But it's actually in a way it's already work in progress. As far as the timing of the announcement, I would say in between Q1 to Q2 next year, because we can't wait any longer, because once the customers start to ramp, to me that clearly is not sufficient. And we are already getting "complaints" from our customers that they want more capacity and they are fighting over our rather limited capacity. So I think it will be pretty soon.

Very helpful there. And last question, with your larger customers you are working on multiple pipeline projects for the WLO and 3D sensing. Do you sense that in a year or 2 you'll be diversified from smartphone exposure or it will be still highly concentrated on smartphones as you go a year or 2 out?

For our own effort, I think smartphone will keep us very, very busy, keep our hands very tight for at least 2 years or 3. There is a -- there is actually a lot of things for you to imagine. This is -- we are really talking about a very, very early stage only. Now we are talking about front-facing camera, front facing 3D sensing, what about rear-facing 3D sensing or rear camera 3D sensing. You are talking about longer distance range, higher power, higher resolution, probably higher ASP. We actually have a product, also already pretty mature for that purpose. But I think us and our customers want to focus on front-facing initially for face recognition, face unlock and e-payments, all these most critical features, and certainly a few other interesting applications. But I think in my prepared remarks I mentioned one thing which is probably overlooked by most. I said Apple's iPhone X with 3D sensing has paved the way for smartphone to become a major AR device. Right now smartphone is already an AR device, but it's not a good AR device, because you can't really scan your environment, your surroundings, you can't really scan that and mix that with your artificial object that you create right. So the current so-called AR in 3D is rather, rather primitive and limited. With the 3D sensing capability, meaning you will be able to scan your surroundings on a 3D basis, full-color basis even, it's going to be very interesting. And I think this will be a major AR device, potentially with tons of apps in the marketplace. And so I will mention you'll have a front facing and also a rear facing 3D sensing, similar to what you have in your cellphones or camera. So with that I think it is an amazing market. Having said that, we are already approached by people from, let's say, robotics application, AR/VR, in particular, even automotives. But right now, we have kind of politely declined the invitation and we'll probably send people to discuss the aspects, requirements, try to understand their requirements more. However, some of our module maker suppliers for our 3D sensing total solution right now, we are actually encouraging them to go and approach other customers and that may lead to some results, I don't know, but for Himax's own effort, we are really -- we are going to be very, very busy with our smartphone for the next, I would say, at least 2 to 3 years.

Our next question comes from the line of Charlie Chan of Morgan Stanley.

So my first question is regarding your industry position, because you said you still consider yourself as a sole supplier for next year in 3D sensing total solution. And my first question is that, is your partnership with Qualcomm is an exclusivity, meaning can Qualcomm work with other partners in coming years? And also one of your competitors AMS just announced their partnership with Sunny Optical in China. So do you or did you expect this competition and what do you think your market share going forward? Thanks.

I certainly cannot disclose the details with of our Qualcomm agreement or arrangement without Qualcomm's prior consent. What I can tell however is that it is with 100% certainty that they are not working with anyone else. And in fact we have been working together for like 5 years already. This is hell of an effort. It's complicated, because as I said there is no reference and I mean bear in mind, we didn't know Apple's going to do iPhone X at the time. And the 2 companies' know-how very much complements each other and that is quite a partnership. And we are certainly very pleased with the fact that Qualcomm is our partner, because 3D sensing, at least in the beginning stage, is going to be for very high-end smartphone only. And Qualcomm being the market dominant player in the AP in that space, certainly that helps tremendously with our efforts. And the next thing I want to comment about Qualcomm relationship is that we are already working on next-generation projects or product with sample, actually very quickly, early sample to be -- come out very quickly. And we are already actually working on third generation. Both generations are major enhancement or improvement of overall performance of our existing products. So even before the Gen 1 goes into mass production, we are already working on Gen 3 already. So this is a very, very tight partnership. And I think it is important to have such tight partnership, because again this requires a lot of -- among all of those components or all this very complex module composition, lot of optimization and trade-off needs to be considered. And for limitations of Qualcomm's algorithms, we can use our optics or our sensor to make up for the shortfall and vice versa for our shortfalls, Qualcomm can use their algorithms to make it up for us. So I think having a tight partnership with the know-how of the 2 companies, I think is a very, very good combination and I think it's a formula for success in the long-term. So we are very happy with the partnership. As far as AMS and Sunny Optics is concerned, I don't want to comment too much on the potential competition. I just want to say, firstly, we are rather confident that we are -- as of now, we are seeing no competition. And given the complexity of the integration, I think it is fair to say that we are not really seeing much threat, at least for the next 2 to 3 years. And one thing I think -- I mean, we see in addition to AMS and Sunny, there are some others claiming to have 3D sensing, but they either come from algorithm background, sourcing all components from outside or they are pure component manufacturers without algorithm background. And I think either approach doesn't make it a total solution. When we say total solution, we emphasize that total solution is a turn-key solution and we -- not just that we are going to offer face unlock, e-payment with security, very, very strong security measure there to protect consumers from privacy, from hacking and so on. So, I think -- other people may talk about total solution, but I think our definition of total solution is probably different. And also, if you look at the immediate future or the current situation, we are seeing so-called competitors, either they are a lot more costly than us with slower performance or, for example, their size may be a lot bulkier than ours, or their solution may not even function in outdoor environment. You know this and that. I think it is fair to say that our solution is the only one that the leading Android names are counting on for next few years reliable mass production right now.

And my second question is regarding your opportunity for that anchor customer. You mentioned multi-new projects, right. But before that, can you sort of clarify -- I think some investors, including me, are certainly confused about what exactly are you doing for the current projects. For example, is that your components in the projector or in ilumnator module and how you define that component? You said LED diffuser or it's a collimator or it is DOE, so before we discuss your future opportunity. Can we clarify what you're doing for current project first? Thanks.

I am afraid, we are not supposed to discuss any details vis-a-vis any major customer, let alone the anchor customer. So I think all I can say is that the shipment involves our WLO manufacturing and it extremely be complex. In terms of the function, the optical component provides and also the degree of difficulty involved for manufacturing. So it is -- for sure, it is not a commodity type of product, otherwise they wouldn't have come to us. And I think it is also safe to say that we are the sole source because of the complexity of the thing. But other than that, I'm not supposed to comment on the customer's name or our exact involvement in their project, present or future.

Okay. So is your new project only limited to WLO, or you are expecting other components can get involved?

Certainly, we love to get involved in more and more things, but that is up to the customer. There are certain things in discussion, but again, it is too early to comment.

Our next question comes from the line of Jerry Su of Credit Suisse.

My first question is related to the future capacity that you plan to set up. You mentioned that you have 2 million units capacity now at your headquarter, plan to add more through the end of the year to the size of [6]. But I'm just curious what kind of -- I mean, are you going to do everything in-house, including the assembly, which is a more labor intensive of the module side, or you're going to -- only going to focus on more sort of more critical parts, WLO, active alignment or these kind of efforts. I am just wondering if you're going to do more of module assembly, or that cost you to -- you need to hire more operators?

It's a very good question. Thank you for raising this issue up. For Himax -- I'm talking about manufacturing only. In terms of design we are involved in just about everything, I am talking about pure manufacturing. Himax's responsibility in the whole SLiM module, includes primarily 2 things, 1 is WLO manufacturing for optics, which involves primarily 2 things. One is DOE and the other one is something we call collimator lens, it's a piece of lens. So WLO facility to manufacture DOE and collimator lens, that is the first thing. The second thing is the so-called active alignment. probably involves -- you need to align our DOE and collimator lens, the optics, very, very precisely with laser, and in the process you need to think about the level of calibration, thermal and all kind of funny issues. So the alignment per se is very critical. That is why we have spent about 2 years with a leading international equipment vendor to develop our own solution in-house, which we believe is the state-of-the-art right now. So our own CapEx involves WLO capacity for DOE and collimator lens manufacturing and also active alignment. With the amount, if you balance the capacity with the amount of WLO being slightly higher than active alignment. We outsource everything else. So for the components we provide, laser drivers, we are design house, we outsource, NIR sensor, we outsource -- and the ASIC, for algorithm we also outsource to foundries. That's our business model. For the whole module, before I talk about the components that are owned by Himax, ourselves, manufactured by our own or outsourced. And there's a third type within the module which is totally outsourced from other people. They are not manufactured or designed by Himax. So you have laser, you have the NIR camera lens, you have IR filter and finally and very importantly, the module assembly, the SLiM module assembly. Right now we have 2 partners who are doing our module assembly for us. Their manufacturing sites are both located in China for obvious reasons. So you are absolutely right, that there is no point for Himax to be doing that ourselves, because that involves a lot of labors and is not really our critical know-how anyway. So I think to sum up, Himax has always been a fabless company and we are pleased to be a fabless company. And with such CapEx, does that make us less fabless or does that make us IDM altogether, I disagree with the IDM concept, because, I think, certainly we are probably a bit less fabless than before, given the fact that we do have in-house fabs. However, I think we are still very much fabless in nature, because if you look at our own CapEx compared to the foundry capacity required to make our ASIC which is a higher logic process and CMOS Image Sensor, which is also very expensive and the lens, the filter, the laser and the module assembly, everything we actually outsource, we only provide the design ourselves. So in a way that ensures we keep our design house nature intact and also we can actually make sure we still enjoy good margin being a design house. I hope that really answers your question.

Yes, thank you. But for the $20 ASP assumption you mentioned, does that include these module assembly of the SLiM or some of the components that you totally outsource are from other partners?

It's an interesting question. That doesn't include the final module assembly, but that includes to most extent; the outsourced components from outside, including say laser and other things. Why is the module, final module assembly not included, because we basically provide our customer with a total turn-key solution, but we only call it a virtual module, why, because you'll appreciate the -- in the iPhone X, people will love the so-called the notch, the upper edge of the screen right, where they have a whole panel of cameras and little holes inside. And why are they doing that? Because that is required, and I always say that is probably the most expensive real estate in the world right now, it's very crowded and it's very precious. So our customers do need to best utilize or fully utilize that little space. So we will give out the finishing, including for example the distance required between the sensor and -- the projector and the receiver, right, for example. And the thermal arrangement that we have put up and so on and so forth. So we tell our customer, this is not to be changed. However, in between you can actually add you little things, other things, for example a RGB camera and some other things, they do have the flexibility to add. In order to accommodate that requirement, our module assembly partner do need to have the capability to cope with such demands and with that -- the more the customers, the end customer wants to add, the more they have to pay, right. So that is not part of our $20 price range. So our $20 is limited to our own module only. Our own module is putting the final assembly.

Okay, that's very clear. And then another question about -- I think you mentioned that for certain customers you could just sell the components instead of the entire module. I think if you look at the Android market today, you have couple of big suppliers -- I mean big smartphone makers in Korea and China and I don't know -- what do you think of the likelihood of -- these are top, maybe let's say top 5 smartphone brands that want to just buy components from Himax instead of using your entire module?

I think, this is how I look at it. There are 2 types, 1 is with in-house AP capability and the other type without. And the ones with in-house capability are certainly less likely to a adopt our total solution as such, because with their AP capability, chances are they will also want to design their own algorithm and with the algorithm the total solution spec will get changed, or design. But within this tiny group of the ones with in-house AP capability, I think very, very few right now has a real capability to have in-house integration for 3D sensing module, right now I can tell you that for sure. Apple certainly is one. So effectively we and Qualcomm together are playing the role, played by Apple itself, in terms of integration. And we are providing the total solution to the entire camp, believing that without a total turn-key solution, most of the customers simply cannot adopt your solution. Now with the ones with in-house AP capability, I think it's fair to say that maybe in the longer term, they will come out with their own solution, but in the immediate future, I think we do have a good opportunity, good chance. Now with even with those small number of customers, it is a lot likely, a lot more likely that maybe they want to have their own algorithm and design their own total solution. However, it is still likely that they may buy our total projector module, projector sub module, so to speak, or even better projectors coupled with sensor and they may -- they may want to have their own algorithm chip, or they may even have their own specification, which may be different from our current solution. But how we are seeing right now is even with their own in-house algorithm and AP capability, there is a very, very good likelihood they will still need to have our projector and the receiver as a couple, as a pair, to supply to them, because again the optimization of the two is very, very critical. So if you want to source one from one party and the other one from the second party, chances are the integration and optimization is a huge headache. So I think even with that our -- even with very small number of limited customers, our business opportunity is still pretty good.

And our next question comes from the line of Kevin Wang of Mizuho.

I have only 1 question. Could you breakdown your non-drivers business revenue by product in Q3, excluding those customers reimbursement? Further, how much revenue or percentage of revenue from CMOS image sensor, WLO, timing controller, NRE and other things respectively? Thank you.

Okay stay with us for a moment please. You're talking about Q3, the past quarter, right?

Yes Q3.

The non- driver, wait a minute, give me the break down -- rough breakdown.

The rough breakdown. Non-driver in Q3 was about 27.9% of the total revenue, right. Well WLO is about 6.5% of our total revenue and the one-time reimbursement is another about 6.7%. And CMOS image sensor is about 3% of our total revenue and 7.2% is the timing controller, the T-con. And the rest are the NRE, majority of those are NRE that we have ongoing development with major customers on future product device.

Our next question comes from the line of Donnie Teng of Nomura.

CFO, could you repeat the WLO sales in third quarter?

About 6.5% of our total revenue.

6.5% of total revenue?

Yes.

Okay, thank you. My first question is related to your fourth quarter guidance and potentially the first quarter rough outlook. So in fourth quarter, your driver IC looks like to be relatively flattish, but your competitor guided the small driver IC can grow in fourth quarter. And as we all know that China smartphone vendors are launching quite a few new products in the fourth quarter. So I'm wondering what's the reason behind the relatively slow small IC driver sales in fourth quarter and is that related to minor TDDI contribution in fourth quarter? And also how do we think about the driver IC momentum in first quarter. Thank you.

I think you got the answer right yourself already. It is indeed about TDDI. And having said that, though, I think overall the smartphone momentum in China, I think, it is at best flattish. Actually I think it probably suffers a slight decline. And I think most customers are doing right now is, firstly, they are cleaning up their old inventories for 16:9 displays, i.e. drivers. And so everything involving new design, new model is 18:9. And I think we mentioned it in our prepared remark that in this new wave of 18:9 smartphone trend for the future, Himax is going to enjoy a very good position and opportunity, because in TDDI, we are indeed behind compared to 2 of our competitors. I think they both came from touch screen or controller background. And we being traditionally a drive IC house, I think for panel maker, which is now the integrator for TDDI, is the integrator for touch and display, they in the first round of design projects, they prefer to partner with people who seem to have better background in the touch panel controller business, because that is something that display drivers traditionally didn't have. But I think -- so we are behind in 16:9. We however -- our comeback approach is we launch, we pioneer the so called interlaced approach. By saying that what they used to do, they still do, is to have -- in 1 piece of IC, the output pad to have on the one side have the display driver pad -- output pad, and on the other side, have a touch panel control output pad]. But the drawback of that approach is that your fan out is more difficult to handle, and also for panel design, also the wiring, the circuitry is more difficult to design. And the result of that is very difficult to narrow down your base bezel or your border, your display border. So we pioneered the whole world in terms of this inerlaced approach, whereby we kind of mix the display driver output pad together with the touch panel control of output pad. So the result is much better design for narrow bezel for our customers. Initially our customers loved the idea, but they are still hesitant to switch, because for them to switch, they need to retape out or retool their display, which is very, very expensive as you may know. However, with the 18:9 new trend, 18:9 display certainly is totally different than 16:9, meaning, regardless of whether they adopt our new approach of TDDI design, they have to retool their display anyway. So many of them decided to take advantage of that to adopt our state-of-the-art 3D design. So we are starting mass production right now, Q3 and Q4 from HD+, and starting from Q1 there will Full HD+ and in many top-tier customers' newborn designs and many panel makers new cell designs, we are the first source. So while we still cannot provide the volume projection for now, but we have reason to be optimistic that we'll enjoy pretty decent growth next year for TDDI.

My follow-up question on this is about that non-drive IC guidance in fourth quarter. You mentioned about 20% sales growth for WLO, but as your main customer is ramping the new product aggressively in fourth quarter, so I'm wondering is that growth momentum slower than you expectation before -- I mean the 20% growth for WLO, and how should we expect the seasonality in first quarter for drive IC and non-drive IC business?

We are actually -- I think we did too well in our manufacturing and yield and delivery, such that we actually are specifically asked to slow down our production in Q4. But they will want us to make it up in Q1. So the total result, there will be no difference and we are seeing unit growth just about quarter-by-quarter next year, although, I cannot give more details beyond that. So I think there's no -- again, in that particular space of ours, it may be small, but it's complex, it's certainly it's not a commodity and we are the sole source and our manufacturing is going very, very smoothly.

How about the first quarter, rough idea about drive IC and non-drive IC seasonality, because I probably would expect that driver IC could slower in first quarter, but non-driver IC may increase due to WLO and probably some contribution from Android 3D sensing. Is that a good guess?

Yes, it is a good guess, except that for -- we are going to categorize TDDI as part of drive IC. So in the smartphone sector, I don't have the number in front of me, but in the smartphone sector, as I said, TDDI is going to grow. The Q4 shipment is not significant, but Q1 we are -- I mean a good guess will be somewhere around 10 million-ish with higher ASP. So potentially that may be a growth area, although Q1 is a low season, as you know.

My last question is regarding to your business model on 3D sensing module. So you mentioned that you have ownership of the 3D sensing module and you have 2 partners for module assembly in China. But as far as I know is that you mentioned about you already have plan to buy active alignment equipment. So, if we simplify the structure of the 3D sensing, say, like a laser transmitter and a receiver and you need to put these 2 sub module together, so what exactly Himax is doing? Is Himax can assemble the transmitter, but outsource the receiver module and the final big module to the partner in China?

Yes, you are right. Our active alignment is only used for the projector meaning transceiver assembly, meaning to align the optics together with laser. Now in the camera module assembly and certainly on the SLiM module assembly, our module assembly partners will also need to invest rather heavily, actually, on their own active alignment equipment, which is different from ours, but they still need to have active alignment for sure, similar to what they have for the high-end camera module assembly.

Thank you. This is a very helpful answer and congratulations on the progress on Android 3D sensing.

Thank you. And that is all the time we have for questions. I'd like to hand the call back over to management for any closing remarks.

Okay, thank you. As a final note, Jackie Chang, our CFO, will maintain investor marketing activities and continue to attend investor conferences. We will announce the details as they come about. Thank you and have a nice day!

All ladies and gentlemen, thank you for participating in today's conference. That does conclude today's program, and you all may disconnect. Everyone, have a great day.